Patent History
  • Application
    US 11/853686 2007-09-11
  • Publication
    US 2008065074 2008-03-13
Supplementary

published patent: SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS

TitleSHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS
Priority Date2007-09-11 US 11/853686
2006-09-13 US 11/844237P
Inventors
Issue Date2008
Citation
US Published patent application US 2008065074. Washington, DC: US Patent and Trademark Office (USPTO), 2008 How to Cite?
AbstractA mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head. Further advantages are provided through the use of a two-way shape memory effect in which the memory device can be closed or tightened by heating up the ambient temperature, and re-opened by cooling down the temperature.
Persistent Identifierhttp://hdl.handle.net/10722/176952
References

 

DC FieldValueLanguage
dc.date.accessioned2012-11-30T08:38:50Z-
dc.date.available2012-11-30T08:38:50Z-
dc.date.issued2008-
dc.identifier.citationUS Published patent application US 2008065074. Washington, DC: US Patent and Trademark Office (USPTO), 2008en_HK
dc.identifier.urihttp://hdl.handle.net/10722/176952-
dc.description.abstractA mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head. Further advantages are provided through the use of a two-way shape memory effect in which the memory device can be closed or tightened by heating up the ambient temperature, and re-opened by cooling down the temperature.en_HK
dc.relation.isreferencedbyUS 2011202042 (A1) 2011-08-18en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documentsen_US
dc.titleSHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTSen_HK
dc.typePatenten_US
dc.description.naturepublished_or_final_versionen_US
dc.contributor.inventorYeung, KWKen_HK
dc.contributor.inventorLu, WWen_HK
dc.contributor.inventorLuk, KDKen_HK
dc.contributor.inventorCheung, KMCen_HK
patents.identifier.applicationUS 11/853686en_HK
patents.description.assigneeUNIV HONG KONGen_HK
patents.description.countryUnited States of Americaen_HK
patents.date.publication2008-03-13en_HK
dc.relation.referencesUS 5496321 (A) 1996-03-05en_HK
dc.relation.referencesUS 5540689 (A) 1996-07-30en_HK
dc.relation.referencesUS 2005080325 (A1) 2005-04-14en_HK
dc.relation.referencesUS 2005154390 (A1) 2005-07-14en_HK
dc.relation.referencesUS 2005277927 (A1) 2005-12-15en_HK
dc.relation.referencesUS 7731736 (B2) 2010-06-08en_HK
dc.relation.referencesUS 2008033431 (A1) 2008-02-07en_HK
dc.relation.referencesUS 5167626 (A) 1992-12-01en_HK
dc.relation.referencesUS 2003127413 (A1) 2003-07-10en_HK
dc.relation.referencesUS 7530466 (B2) 2009-05-12en_HK
dc.relation.referencesUS 2007171609 (A1) 2007-07-26en_HK
patents.identifier.hkutechidO&T-2006-00209-1-
patents.date.application2007-09-11en_HK
patents.date.priority2007-09-11 US 11/853686en_HK
patents.date.priority2006-09-13 US 11/844237Pen_HK
patents.description.ccUSen_HK
patents.identifier.publicationUS 2008065074en_HK
patents.relation.familyCN 101511291 (A) 2009-08-19en_HK
patents.relation.familyEP 2077779 (A1) 2009-07-15en_HK
patents.relation.familyUS 2008065074 (A1) 2008-03-13en_HK
patents.relation.familyWO 2008043254 (A1) 2008-04-17en_HK
patents.description.kindA1en_HK
patents.typePatent_publisheden_HK

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