File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Conference Paper: Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems

TitleOptimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems
Authors
Ong, AOAbramson, ARTien, NC
KeywordsCorona Discharge
Cpu Fan
Electrohydrodynamics
Emerging Technology
Forced Convection Air Cooling
Heat Transfer
Optimized Design
Semiconductor
Thermal Management
Issue Date2012
Citation
Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems, Itherm, 2012, p. 1306-1311 How to Cite?
DOI: http://dx.doi.org/10.1109/ITHERM.2012.6231571
AbstractThis work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans. © 2012 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/176496
ISSN
1936-3958
2020 SCImago Journal Rankings: 0.201
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorOng, AOen_US
dc.contributor.authorAbramson, ARen_US
dc.contributor.authorTien, NCen_US
dc.date.accessioned2012-11-26T09:50:22Z-
dc.date.available2012-11-26T09:50:22Z-
dc.date.issued2012en_US
dc.identifier.citationIntersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems, Itherm, 2012, p. 1306-1311en_US
dc.identifier.issn1936-3958en_US
dc.identifier.urihttp://hdl.handle.net/10722/176496-
dc.description.abstractThis work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans. © 2012 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERMen_US
dc.subjectCorona Dischargeen_US
dc.subjectCpu Fanen_US
dc.subjectElectrohydrodynamicsen_US
dc.subjectEmerging Technologyen_US
dc.subjectForced Convection Air Coolingen_US
dc.subjectHeat Transferen_US
dc.subjectOptimized Designen_US
dc.subjectSemiconductoren_US
dc.subjectThermal Managementen_US
dc.titleOptimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systemsen_US
dc.typeConference_Paperen_US
dc.identifier.emailTien, NC: nctien@hku.hken_US
dc.identifier.authorityTien, NC=rp01604en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/ITHERM.2012.6231571en_US
dc.identifier.scopuseid_2-s2.0-84866172348en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-84866172348&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage1306en_US
dc.identifier.epage1311en_US
dc.identifier.scopusauthoridOng, AO=55357279900en_US
dc.identifier.scopusauthoridAbramson, AR=55228392800en_US
dc.identifier.scopusauthoridTien, NC=7006532826en_US
dc.identifier.issnl1936-3958-

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats