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Article: Strain and temperature dependence of deformation banding

TitleStrain and temperature dependence of deformation banding
Authors
Issue Date1994
PublisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net
Citation
Materials Science Forum, 1994, v. 157-6 pt 1, p. 801-806 How to Cite?
AbstractIn the rolling of wedge shaped copper specimens of different grain sizes, the strain at which deformation banding become discernible is found to be dependent on grain size and rolling temperature. Utilizing SEM micrographs of crystallographically etched samples, statistical analysis of sheet plane and longitudinal sections were conducted to better understand the onset of deformation banding. The orientation dependency of deformation banding are found to be complex. The effect of temperature was studied by rolling the samples at 300 °C in a single pass to 50% of original thickness. Complex microstructures were observed and with the aid of Electron Back Scattering Pattern (EBSP) technique, the result put forward a new approach in the study of the evolution of deformation texture.
Persistent Identifierhttp://hdl.handle.net/10722/174044
ISSN
2005 Impact Factor: 0.399

 

DC FieldValueLanguage
dc.contributor.authorLim, Een_US
dc.contributor.authorGreene, GWen_US
dc.contributor.authorDuggan, BJen_US
dc.date.accessioned2012-11-14T06:20:23Z-
dc.date.available2012-11-14T06:20:23Z-
dc.date.issued1994en_US
dc.identifier.citationMaterials Science Forum, 1994, v. 157-6 pt 1, p. 801-806en_US
dc.identifier.issn0255-5476en_US
dc.identifier.urihttp://hdl.handle.net/10722/174044-
dc.description.abstractIn the rolling of wedge shaped copper specimens of different grain sizes, the strain at which deformation banding become discernible is found to be dependent on grain size and rolling temperature. Utilizing SEM micrographs of crystallographically etched samples, statistical analysis of sheet plane and longitudinal sections were conducted to better understand the onset of deformation banding. The orientation dependency of deformation banding are found to be complex. The effect of temperature was studied by rolling the samples at 300 °C in a single pass to 50% of original thickness. Complex microstructures were observed and with the aid of Electron Back Scattering Pattern (EBSP) technique, the result put forward a new approach in the study of the evolution of deformation texture.en_US
dc.languageengen_US
dc.publisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.neten_US
dc.relation.ispartofMaterials Science Forumen_US
dc.titleStrain and temperature dependence of deformation bandingen_US
dc.typeArticleen_US
dc.identifier.emailDuggan, BJ: bjduggan@hkucc.hku.hken_US
dc.identifier.authorityDuggan, BJ=rp01686en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0028666577en_US
dc.identifier.volume157-6en_US
dc.identifier.issuept 1en_US
dc.identifier.spage801en_US
dc.identifier.epage806en_US
dc.publisher.placeSwitzerlanden_US
dc.identifier.scopusauthoridLim, E=7201711151en_US
dc.identifier.scopusauthoridGreene, GW=7102617510en_US
dc.identifier.scopusauthoridDuggan, BJ=7005772998en_US

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