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  Patent History
  • Application
    US 10/300323 2002-11-20
  • Publication
    US 20030094034 2003-05-22
  • Granted
    US 6883367 2005-04-26

granted patent: Method For Measuring Elastic Properties

TitleMethod For Measuring Elastic Properties
Granted PatentUS 6883367
Granted Date2005-04-26
Priority Date2002-11-20 US 10/300323
2001-11-20 US 09/331751P
Inventors
Issue Date2005
Citation
US Patent 6883367. Washington, DC: US Patent and Trademark Office (USPTO), 2005 How to Cite?
AbstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.
Persistent Identifierhttp://hdl.handle.net/10722/142146
References

 

DC FieldValueLanguage
dc.date.accessioned2011-10-19T06:30:20Z-
dc.date.available2011-10-19T06:30:20Z-
dc.date.issued2005-
dc.identifier.citationUS Patent 6883367. Washington, DC: US Patent and Trademark Office (USPTO), 2005en_HK
dc.identifier.urihttp://hdl.handle.net/10722/142146-
dc.description.abstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.en_HK
dc.relation.isreferencedbyWO 2011124984 (A2) 2011-10-13en_HK
dc.relation.isreferencedbyWO 2011124984 (A3) 2012-01-05en_HK
dc.relation.isreferencedbyWO 2011124955 (A1) 2011-10-13en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documents-
dc.titleMethod For Measuring Elastic Propertiesen_HK
dc.typePatenten_US
dc.identifier.emailFeng, Gang:en_US
dc.identifier.emailNgan, Alfonso Hing Wan:hwngan@hkucc.hku.hken_US
dc.identifier.authorityNgan, Alfonso Hing Wan=rp00225en_US
dc.description.naturepublished_or_final_version-
dc.identifier.hkuros98027en_US
dc.contributor.inventorFeng, Gangen_US
dc.contributor.inventorNgan, Alfonso Hing Wanen_US
patents.identifier.applicationUS 10/300323en_HK
patents.identifier.grantedUS 6883367en_HK
patents.description.assigneeUniv Hong Kong [Cn]en_HK
patents.description.countryUnited States of Americaen_HK
patents.date.publication2003-05-22en_HK
patents.date.granted2005-04-26en_HK
dc.relation.referencesUS 3969928 (A) 1976-07-20en_HK
dc.relation.referencesUS 4699000 (A) 1987-10-13en_HK
dc.relation.referencesUS 4848141 (A) 1989-07-18en_HK
dc.relation.referencesUS 5133210 (A) 1992-07-28en_HK
dc.relation.referencesUS 5320800 (A) 1994-06-14en_HK
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dc.relation.referencesUS 6134954 (A) 2000-10-24en_HK
dc.relation.referencesUS 6247355 (B1) 2001-06-19en_HK
dc.relation.referencesUS 6311135 (B1) 2001-10-30en_HK
dc.relation.referencesUS 2003099495 (A1) 2003-05-29en_HK
dc.relation.referencesUS 6712532 (B2) 2004-03-30en_HK
patents.identifier.hkutechidME-2001-00058-1en_US
patents.date.application2002-11-20en_HK
patents.date.priority2002-11-20 US 10/300323en_HK
patents.date.priority2001-11-20 US 09/331751Pen_HK
patents.description.ccUSen_HK
patents.identifier.publicationUS 20030094034en_HK
patents.relation.familyEP 1314970 (A2) 2003-05-28en_HK
patents.relation.familyUS 2003094034 (A1) 2003-05-22en_HK
patents.relation.familyUS 6883367 (B2) 2005-04-26en_HK
patents.relation.familyUS 2005066702 (A1) 2005-03-31en_HK
patents.description.kindB2en_HK
patents.typePatent_granteden_HK

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