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  Patent History
  • Application
    EP20020257993 2002-11-20
  • Publication
    EP 1314970 2007-01-10
  • Granted
    1314970 2007-01-10
Supplementary

published patent: Method For Measuring Elastic Properties

TitleMethod For Measuring Elastic Properties
Granted Patent1314970
Granted Date2007-01-10
Priority Date2001-11-20 US 09/331751P
Inventors
Issue Date2007
Citation
EP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 How to Cite?
Abstract
This Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.
Persistent Identifierhttp://hdl.handle.net/10722/142145

 

DC FieldValueLanguage
dc.date.accessioned2011-10-19T06:30:19Z-
dc.date.available2011-10-19T06:30:19Z-
dc.date.issued2007-
dc.identifier.citationEP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007en_HK
dc.identifier.urihttp://hdl.handle.net/10722/142145-
dc.description.abstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documents-
dc.titleMethod For Measuring Elastic Propertiesen_HK
dc.typePatenten_US
dc.identifier.emailNgan, Alfonso Hing Wan:hwngan@hkucc.hku.hken_US
dc.identifier.authorityNgan, Alfonso Hing Wan=rp00225en_US
dc.description.naturepublished_or_final_version-
dc.contributor.inventorFeng, Gangen_HK
dc.contributor.inventorNgan, Alfonso Hing Wanen_HK
patents.identifier.applicationEP20020257993en_HK
patents.identifier.granted1314970en_US
patents.description.assigneeUniv Hong Kong [Cn]en_HK
patents.description.countryEuropean Patent Officeen_HK
patents.date.publication2007-01-10en_HK
patents.date.granted2007-01-10en_US
patents.identifier.hkutechidME-2001-00058en_US
patents.date.application2002-11-20en_HK
patents.date.priority2001-11-20 US 09/331751Pen_HK
patents.description.ccEPen_HK
patents.identifier.publicationEP 1314970en_HK
patents.relation.familyEP 1314970 (A2) 2003-05-28en_HK
patents.relation.familyUS 2003094034 (A1) 2003-05-22en_HK
patents.relation.familyUS 6883367 (B2) 2005-04-26en_HK
patents.relation.familyUS 2005066702 (A1) 2005-03-31en_HK
patents.description.kindB1en_HK
patents.typePatent_publisheden_HK

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