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Patent History
  • Application
    EP20020257993 2002-11-20
  • Publication
    EP 1314970 2007-01-10
  • Granted
    1314970 2007-01-10
 
Supplementary

Published Patent: Method For Measuring Elastic Properties
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TitleMethod For Measuring Elastic Properties
 
Granted Patent1314970
 
Granted Date2007-01-10
 
Priority Date2001-11-20 US 09/331751P
 
InventorsFeng, Gang
Ngan, Alfonso Hing Wan
 
Issue Date2007
 
CitationEP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 [How to Cite?]
 
AbstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.
 
DC FieldValue
dc.contributor.inventorFeng, Gang
 
dc.contributor.inventorNgan, Alfonso Hing Wan
 
dc.date.accessioned2011-10-19T06:30:19Z
 
patents.date.application2002-11-20
 
dc.date.available2011-10-19T06:30:19Z
 
patents.date.granted2007-01-10
 
dc.date.issued2007
 
patents.date.priority2001-11-20 US 09/331751P
 
patents.date.publication2007-01-10
 
dc.description.abstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.
 
patents.description.assigneeUniv Hong Kong [Cn]
 
patents.description.ccEP
 
patents.description.countryEuropean Patent Office
 
patents.description.kindB1
 
patents.identifier.applicationEP20020257993
 
dc.identifier.citationEP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 [How to Cite?]
 
patents.identifier.granted1314970
 
patents.identifier.hkutechidME-2001-00058
 
patents.identifier.publicationEP 1314970
 
dc.identifier.urihttp://hdl.handle.net/10722/142145
 
patents.relation.familyEP 1314970 (A2) 2003-05-28
 
patents.relation.familyUS 2003094034 (A1) 2003-05-22
 
patents.relation.familyUS 6883367 (B2) 2005-04-26
 
patents.relation.familyUS 2005066702 (A1) 2005-03-31
 
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documents
 
dc.titleMethod For Measuring Elastic Properties
 
dc.typePatent
 
patents.typePatent_published
 
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