Published Patent: Method For Measuring Elastic Properties

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Patent History
  • Application
    EP20020257993
    2002-11-20
  • Publication
    EP 1314970
    2007-01-10
  • Granted
    1314970
    2007-01-10
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TitleMethod For Measuring Elastic Properties
Granted Patent1314970
Granted Date2007-01-10
Priority Date2001-11-20 US 09/331751P
InventorsFeng, Gang,
Hing Wan Ngan, Alfonso
CitationEP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 [How to Cite?]
AbstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.
DC Field
Value
dc.contributor.inventorFeng, Gang,
dc.contributor.inventorHing Wan Ngan, Alfonso
dc.date.accessioned2011-10-19T06:30:19Z
patents.date.application2002-11-20
dc.date.available2011-10-19T06:30:19Z
patents.date.granted2007-01-10
patents.date.priority2001-11-20 US 09/331751P
patents.date.publication2007-01-10
dc.description.abstractThis Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System.
patents.description.assigneeUniv Hong Kong [Cn]
patents.description.ccEP
patents.description.countryEuropean Patent Office
patents.description.kindB1
patents.identifier.applicationEP20020257993
dc.identifier.citationEP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 [How to Cite?]
patents.identifier.granted1314970
patents.identifier.hkutechidME-2001-00058
patents.identifier.publicationEP 1314970
dc.identifier.urihttp://hdl.handle.net/10722/142145
patents.relation.familyEP 1314970 (A2) 2003-05-28
patents.relation.familyUS 2003094034 (A1) 2003-05-22
patents.relation.familyUS 6883367 (B2) 2005-04-26
patents.relation.familyUS 2005066702 (A1) 2005-03-31
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documents
dc.titleMethod For Measuring Elastic Properties
dc.typePatent
patents.typePatent_published