Deformation in adhesive joints using moire interferometry
Grant Data
Project Title
Deformation in adhesive joints using moire interferometry
Principal Investigator
Professor Asundi, Anand
(Principal Investigator (PI))
Co-Investigator(s)
Dr Woo Chun Wai
(Co-principal investigator)
Start Date
1985-09-01
Amount
0
Conference Title
Deformation in adhesive joints using moire interferometry
Presentation Title
Keywords
null
Discipline
N/A
HKU Project Code
N/A
Grant Type
Other Funding Scheme
Funding Year
1985
Status
Completed
Objectives
To use high sensitivity moire interferometry to determine strains within the thin adhesive layer of an adhesive bonded joint. Various joint configurations will be investigated.