Deformation in adhesive joints using moire interferometry


Grant Data
Project Title
Deformation in adhesive joints using moire interferometry
Principal Investigator
Professor Asundi, Anand   (Principal investigator)
Co-Investigator(s)
Dr Woo Chun Wai   (Co-principal investigator)
Start Date
1985-09-01
Amount
0
Conference Title
Presentation Title
Grant Type
Other Funding Scheme
Funding Year
1985/1986
Status
Completed
Objectives
To use high sensitivity moire interferometry to determine strains within the thin adhesive layer of an adhesive bonded joint. Various joint configurations will be investigated.