| Title | Author(s) | Year | View Count |
 | Volume discounting coordinates a supply chain effectively when demand is sensitive to both price and sales effort | Lau, HS; Su, C; Wang, YY; Hua, ZS | 2012 | 40 |
| Defending and improving the 'slotting fee': how it can benefit all the stakeholders dealing with a newsvendor product with price and effort-dependent demand | Wang, YY; Lau, HS; Wang, JC | 2012 | 62 |
| Three revenue-sharing variants: their significant performance differences under system-parameter uncertainties | Wang, YY; Lau, HS; Hua, ZS | 2012 | 44 |
| The simple and easy way to manufacture counter electrode for dye-sensitized solar cells | Lan, JL; Wang, YY; Wan, CC; Wei, TC; Feng, HP; Peng, C; Cheng, HP; Chang, YH; Hsu, WC | 2010 | 175 |
| Effect of impurity and illumination on copper oxidation after chemical mechanical polishing | Feng, HP; Lin, JY; Wang, YY; Wan, CC | 2008 | 160 |
| Behavior of copper removal by CMP and its correlation to deposit structure and impurity content | Feng, HP; Lin, JY; Cheng, MY; Wang, YY; Wan, CC | 2008 | 155 |
| Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse plating | Lin, JY; Wan, CC; Wang, YY; Feng, HP | 2007 | 144 |
| Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization | Lin, JY; Wang, YY; Wan, CC; Feng, HP; Cheng, MY | 2007 | 141 |
| Investigation of the behaviors of various electroplated copper films during CMP | Feng, HP; Cheng, MY; Wang, YY; Wan, CC | 2006 | 157 |
| Mechanism for Cu void defect on various electroplated film conditions | Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC | 2006 | 241 |
| Analysis of parental strain DNA fragments existing in GEMs-Fhhh | Hao, CB; Yan, J; Qu, MM; Wang, D; Cheng, SP; Gu, JD; Qiu, WF; Wang, YY | 2003 | 158 |
| Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation | Fong, HP; Wu, Y; Wang, YY; Wan, CC | 2003 | 113 |
| Aerobic and anaerobic degradation pathways for N-heterocyclic aromatic compound indole | Wang, YY; Yip, CW; Fan, YZ; Gu, JD | 2003 | 35 |
| Displacement reactions between metal ions and nitride barrier layer/silicon substrate | Wu, Y; Chen, WC; Fong, HP; Wan, CC; Wang, YY | 2002 | 164 |
| Offline signature verification by the analysis of cursive strokes | Fang, B; Wang, YY; Leung, CH; Tse, KW; Tang, YY; Kwok, PCK; Wong, YK | 2001 | 85 |
 | A smoothness Index-based approach for off-line signature verification | Fang, B; Wang, YY; Leung, CH; Tang, YY; Kwok, PCK; Tse, KW; Wong, YK | 1999 | 166 |
| Momentum-dependent charge transfer excitations in Sr2CuO2Cl2 angle-resolved electron energy loss spectroscopy | Wang, YY; Zhang, FC; Dravid, VP; Ng, KK; Klein, MV; Schnatterly, SE; Miller, LL | 1996 | 27 |
| Positron mobility and interface defect studies in semi-insulating GaAs using the lifetime technique | Shan, YY; Ling, CC; Au, HL; Fung, S; Beling, CD; Wang, YY | 1995 | 127 |
| Momentum-transfer resolved electron energy loss spectroscopy of solids: Problems, solutions and applications | Wang, YY; Cheng, SC; Dravid, VP; Zhang, FC | 1995 | 44 |
 | Au/GaAs interface annealing study by positron-lifetime spectroscopy | Shan, YY; Panda, BK; Fung, S; Beling, CD; Wang, YY | 1995 | 567 |
|
