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TypeTitleAuthor(s)YearViews
Volume discounting coordinates a supply chain effectively when demand is sensitive to both price and sales effort
Journal:
Computers & Operations Research
Publisher:
Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/cor
Lau, HS; Su, C; Wang, YY; Hua, ZS201272
 
Defending and improving the 'slotting fee': how it can benefit all the stakeholders dealing with a newsvendor product with price and effort-dependent demand
Journal:
Journal of the Operational Research Society
Publisher:
Palgrave Macmillan Ltd. The Journal's web site is located at http://www.palgrave-journals.com/jors/index.html
Wang, YY; Lau, HS; Wang, JC2012408
 
Three revenue-sharing variants: their significant performance differences under system-parameter uncertainties
Journal:
Journal of the Operational Research Society
Publisher:
Palgrave Macmillan Ltd. The Journal's web site is located at http://www.palgrave-journals.com/jors/index.html
Wang, YY; Lau, HS; Hua, ZS201270
 
The simple and easy way to manufacture counter electrode for dye-sensitized solar cells
Journal:
Current Applied Physics
Publisher:
Elsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/cap
Lan, JL; Wang, YY; Wan, CC; Wei, TC; Feng, HP; Peng, C; Cheng, HP; Chang, YH; Hsu, WC2010247
 
Effect of impurity and illumination on copper oxidation after chemical mechanical polishing
Journal:
Journal of the Electrochemical Society
Publisher:
Electrochemical Society, Inc. The Journal's web site is located at http://ojps.aip.org/JES
Feng, HP; Lin, JY; Wang, YY; Wan, CC2008218
 
Behavior of copper removal by CMP and its correlation to deposit structure and impurity content
Journal:
Journal of the Electrochemical Society
Publisher:
Electrochemical Society, Inc. The Journal's web site is located at http://ojps.aip.org/JES
Feng, HP; Lin, JY; Cheng, MY; Wang, YY; Wan, CC2008231
 
Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse plating
Journal:
Journal of the Electrochemical Society
Publisher:
Electrochemical Society, Inc. The Journal's web site is located at http://ojps.aip.org/JES
Lin, JY; Wan, CC; Wang, YY; Feng, HP2007158
 
Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization
Journal:
Electrochemical and Solid-State Letters
Publisher:
Electrochemical Society, Inc. The Journal's web site is located at http://scitation.aip.org/ESL/
Lin, JY; Wang, YY; Wan, CC; Feng, HP; Cheng, MY2007221
 
Mechanism for Cu void defect on various electroplated film conditions
Proceedings/Conference:
Thin Solid Films
Publisher:
Elsevier S.A.. The Journal's web site is located at http://www.elsevier.com/locate/tsf
Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC2006375
 
Investigation of the behaviors of various electroplated copper films during CMP
Proceedings/Conference:
2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings
Feng, HP; Cheng, MY; Wang, YY; Wan, CC2006181
 
Analysis of parental strain DNA fragments existing in GEMs-Fhhh
Journal:
Journal of Environmental Sciences
Publisher:
I O S Press. The Journal's web site is located at http://www.iospress.nl/html/10010742.php
Hao, CB; Yan, J; Qu, MM; Wang, D; Cheng, SP; Gu, JD; Qiu, WF; Wang, YY2003171
 
Aerobic and anaerobic degradation pathways for N-heterocyclic aromatic compound indole
Journal:
Bulletin of Mineralogy Petrology and Geochemistry
Publisher:
中國礦物巖石地球化學學會. The Journal's web site is located at http://kydh.chinajournal.net.cn/
Wang, YY; Yip, CW; Fan, YZ; Gu, JD2003116
 
Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation
Journal:
Journal of Electronic Materials
Publisher:
Springer New York LLC
Fong, HP; Wu, Y; Wang, YY; Wan, CC2003157
 
Displacement reactions between metal ions and nitride barrier layer/silicon substrate
Journal:
Journal of the Electrochemical Society
Publisher:
Electrochemical Society, Inc. The Journal's web site is located at http://ojps.aip.org/JES
Wu, Y; Chen, WC; Fong, HP; Wan, CC; Wang, YY2002213
 
Offline signature verification by the analysis of cursive strokes
Journal:
International Journal of Pattern Recognition and Artificial Intelligence
Publisher:
World Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/ijprai/ijprai.shtml
Fang, B; Wang, YY; Leung, CH; Tse, KW; Tang, YY; Kwok, PCK; Wong, YK2001122
 
A smoothness Index-based approach for off-line signature verification
Proceedings/Conference:
Proceedings of ICDAR'99, the 5th International Conference on Document Analysis and Recognition
Fang, B; Wang, YY; Leung, CH; Tang, YY; Kwok, PCK; Tse, KW; Wong, YK1999158
 
Momentum-dependent charge transfer excitations in Sr2CuO2Cl2 angle-resolved electron energy loss spectroscopy
Journal:
Physical Review Letters
Publisher:
American Physical Society. The Journal's web site is located at http://prl.aps.org
Wang, YY; Zhang, FC; Dravid, VP; Ng, KK; Klein, MV; Schnatterly, SE; Miller, LL199684
 
Momentum-transfer resolved electron energy loss spectroscopy of solids: Problems, solutions and applications
Proceedings/Conference:
Ultramicroscopy
Publisher:
Elsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/ultramic
Wang, YY; Cheng, SC; Dravid, VP; Zhang, FC1995105
 
Au/GaAs interface annealing study by positron-lifetime spectroscopy
Journal:
Physical Review B
Publisher:
American Physical Society. The Journal's web site is located at http://prb.aps.org/
Shan, YY; Panda, BK; Fung, S; Beling, CD; Wang, YY1995582
 
Positron mobility and interface defect studies in semi-insulating GaAs using the lifetime technique
Journal:
Materials Science Forum
Publisher:
Trans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net
Shan, YY; Ling, CC; Au, HL; Fung, S; Beling, CD; Wang, YY1995149
 
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