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Volume discounting coordinates a supply chain effectively when demand is sensitive to both price and sales effortLau, HS; Su, C; Wang, YY; Hua, ZS201251
Defending and improving the 'slotting fee': how it can benefit all the stakeholders dealing with a newsvendor product with price and effort-dependent demandWang, YY; Lau, HS; Wang, JC2012374
Three revenue-sharing variants: their significant performance differences under system-parameter uncertaintiesWang, YY; Lau, HS; Hua, ZS201253
The simple and easy way to manufacture counter electrode for dye-sensitized solar cellsLan, JL; Wang, YY; Wan, CC; Wei, TC; Feng, HP; Peng, C; Cheng, HP; Chang, YH; Hsu, WC2010209
Effect of impurity and illumination on copper oxidation after chemical mechanical polishingFeng, HP; Lin, JY; Wang, YY; Wan, CC2008174
Behavior of copper removal by CMP and its correlation to deposit structure and impurity contentFeng, HP; Lin, JY; Cheng, MY; Wang, YY; Wan, CC2008181
Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse platingLin, JY; Wan, CC; Wang, YY; Feng, HP2007123
Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarizationLin, JY; Wang, YY; Wan, CC; Feng, HP; Cheng, MY2007177
Mechanism for Cu void defect on various electroplated film conditionsFeng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC2006321
Investigation of the behaviors of various electroplated copper films during CMPFeng, HP; Cheng, MY; Wang, YY; Wan, CC2006159
Analysis of parental strain DNA fragments existing in GEMs-FhhhHao, CB; Yan, J; Qu, MM; Wang, D; Cheng, SP; Gu, JD; Qiu, WF; Wang, YY2003149
Aerobic and anaerobic degradation pathways for N-heterocyclic aromatic compound indoleWang, YY; Yip, CW; Fan, YZ; Gu, JD200382
Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activationFong, HP; Wu, Y; Wang, YY; Wan, CC2003119
Displacement reactions between metal ions and nitride barrier layer/silicon substrateWu, Y; Chen, WC; Fong, HP; Wan, CC; Wang, YY2002178
Offline signature verification by the analysis of cursive strokesFang, B; Wang, YY; Leung, CH; Tse, KW; Tang, YY; Kwok, PCK; Wong, YK200193
A smoothness Index-based approach for off-line signature verificationFang, B; Wang, YY; Leung, CH; Tang, YY; Kwok, PCK; Tse, KW; Wong, YK1999142
Momentum-dependent charge transfer excitations in Sr2CuO2Cl2 angle-resolved electron energy loss spectroscopyWang, YY; Zhang, FC; Dravid, VP; Ng, KK; Klein, MV; Schnatterly, SE; Miller, LL199661
Momentum-transfer resolved electron energy loss spectroscopy of solids: Problems, solutions and applicationsWang, YY; Cheng, SC; Dravid, VP; Zhang, FC199577
Au/GaAs interface annealing study by positron-lifetime spectroscopyShan, YY; Panda, BK; Fung, S; Beling, CD; Wang, YY1995549
Positron mobility and interface defect studies in semi-insulating GaAs using the lifetime techniqueShan, YY; Ling, CC; Au, HL; Fung, S; Beling, CD; Wang, YY1995120
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