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Showing results 1 to 6 of 6

	Title	Author(s)	Issue Date	Views
	Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010	Jiang, L Xu, C Smith, H Rubin, B Deutsch, A Caron, A	2010	175
	Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD	Xu, C Jiang, L Kolluri, SK Rubin, BJ Deutsch, A Smith, H Banerjee, K	2009	171
	HBV genotype predicts graft re-infection and mortality after liver transplantation: The effect of genotype D and interaction with genotype A Proceeding/Conference:Hepatology	Girlanda, R Mohsen, AH Smith, H Sablon, E Yuen, RMF O'Grady, J Muiesan, P Rela, M Heaton, N Norris, S	2002	99
	Hepatitis B virus genotype A and D clinical outcomes of liver transplantation for HBV-related disease Journal:Liver Transplantation	Girlanda, R Mohsen, AH Smith, H Sablon, E Yuen, MF O'grady, J Muiesan, P Rela, M Heaton, N Norris, S	2004	124
	Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Jiang, L Kolluri, S Rubin, BJ Smith, H Colgan, EG Scheuermann, MR Wakit, JA Deutsch, A Gill, J	2008	114
	A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging	Jiang, L Xu, C Rubin, BJ Weger, AJ Deutsch, A Smith, H Caron, A Banerjee, K	2010	153

Showing results 1 to 6 of 6