Browsing by Author Smith, H

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Showing results 1 to 6 of 6
TitleAuthor(s)Issue DateViews
 
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
2010
68
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
2009
81
 
2002
55
 
2004
62
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2008
72
 
2010
66