Browsing by Author Hui, TW

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Showing results 1 to 8 of 8
TitleAuthor(s)Issue DateViews
 
3-D measurement of solder paste using two-step phase shift profilometry
Journal:IEEE Transactions on Electronics Packaging Manufacturing
2008
113
3D profile reconstruction of solder paste based on phase shift profilometry
Proceeding/Conference:IEEE International Conference on Industrial Informatics (INDIN)
2007
76
2008
132
 
2007
91
 
2009
54
 
2010
84
 
Solder paste inspection using region-based defect detection
Journal:International Journal of Advanced Manufacturing Technology
2009
108
 
2011
85