Results 1 to 19 of 19
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TypeTitleAuthor(s)YearViews
An elliptic phase-shifting algorithm for high speed three-dimensional profilometryDeng, F; Li, Z; Chen, J; Deng, J; Fung, KSM; Lam, EY201330
 
A polynomial phase-shift algorithm for high precision three-dimensional profilometryDeng, F; Liu, C; Sze, W; Deng, J; Fung, KSM; Lam, EY201341
 
An illumination-invariant phase-shifting algorithm for three-dimensional profilometryDeng, F; Liu, C; Sze, W; Deng, J; Fung, KSM; Leung, WH; Lam, EY201293
 
Regularized multiframe phase-shifting algorithm for three-dimensional profilometryDeng, F; Sze, WF; Deng, J; Fung, KSM; Leung, WH; Lam, EY2012120
 
Height inspection of wafer bumps without explicit 3-D reconstructionDong, M; Chung, R; Lam, EY; Fung, KSM201057
 
An edge detection algorithm based on rectangular gaussian kernels for machine vision applicationsDeng, F; Fung, KSM; Deng, J; Lam, EY2009245
 
Handling of multi-reflections in wafer bump 3D reconstructionCheng, J; Chung, R; Lam, EY; Fung, KSM2008177
 
Erratum: Projection optics design for tilted projection of fringe patterns (Optical Engineering (2008) 47 (053002))Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F200857
 
Projection optics design for tilted projection of fringe patternsShu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2008256
 
Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstructionCheng, J; Chung, CKR; Lam, EY; Fung, KSM; Wang, F; Leung, WH2008434
 
A novel design of grating projection system for 3D reconstruction of wafer bumpsShu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2006126
 
Boundary detection of projected fringes on surface with inhomogeneous reflectance functionCheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH200666
 
Bit-pairing codification for binary pattern projection systemCheng, J; Chung, R; Lam, EY; Fung, KSM2006410
 
Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale MorphologyNg, NY; Lam, EYM; Chung, R; Fung, KSM; Leung, WH2005124
 
Three-dimensional reconstruction of wafer solder bumps using binary pattern projectionCheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH2005698
 
Reference-free detection of semiconductor assembly defectNg, ANY; Lam, EY; Chung, R; Fung, KSM; Leung, WH2005703
 
Intraoperative monitoring of somatosensory evoked potential in the spinal cord rectification operation by means of wavelet analysisLiu, W; Du, MH; Chan, FHY; Lam, FK; Luk, DK; Hu, Y; Fung, KSM; Qiu, W199871
 
Fast measurement of SEP for monitoring spinal cord during scoliosisFung, KSM; Du, MH; Liu, WQ; Chan, FHY; Lam, FK; Luk, DK; Hu, Y1998354
 
Adaptive neural network filter for visual evoked potential estimationFung, KSM; Lam, FK; Chan, FHY; Poon, PWF; Liu, JG1995375
 
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