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Showing results 1 to 11 of 11

	Title	Author(s)	Issue Date	Views
	Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration Proceeding/Conference:2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09	Xie, J Chung, D Swaminathan, M Mcallister, M Deutsch, A Jiang, L Rubin, BJ	2009	121
	Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010	Jiang, L Xu, C Smith, H Rubin, B Deutsch, A Caron, A	2010	187
	Electrical-thermal co-analysis for power delivery networks in 3D system integration Proceeding/Conference:2009 IEEE International Conference on 3D System Integration, 3DIC 2009	Xie, J Chung, D Swaminathan, M Mcallister, M Deutsch, A Jiang, L Rubin, BJ	2009	213
	Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD	Xu, C Jiang, L Kolluri, SK Rubin, BJ Deutsch, A Smith, H Banerjee, K	2009	190
	Interconnect performance and scaling strategy for the 22 nm node and beyond Proceeding/Conference:Advanced Metallization Conference (AMC)	Chen, JHC Jiang, L Deutsch, A Angyal, MS Spooner, TA	2009	116
	Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer Proceeding/Conference:Proceedings - Electronic Components and Technology Conference	Morsey, JD Jiang, L Rubin, BJ Deutsch, A Surovic, CW Becker, D Haridass, A	2008	118
	Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Hesford, AJ Morsey, JD Chew, WC Deutsch, A Smith, HH	2007
	Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Jiang, L Kolluri, S Rubin, BJ Smith, H Colgan, EG Scheuermann, MR Wakit, JA Deutsch, A Gill, J	2008	130
	A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging	Jiang, L Xu, C Rubin, BJ Weger, AJ Deutsch, A Smith, H Caron, A Banerjee, K	2010	159
	The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM Proceeding/Conference:IEEE Transactions on Advanced Packaging	Morsey, J Deutsch, A Libous, JP Surovic, C Rubin, BJ Jiang, L Eisenberg, L	2007	119
	The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Morsey, J Deutsch, A Libous, JP Surovic, C Rubin, BJ Jiang, L Eisenberg, L	2005	120

Showing results 1 to 11 of 11