Browsing by Author Deutsch, A

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Showing results 1 to 11 of 11
TitleAuthor(s)Issue DateViews
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
Proceeding/Conference:2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
2009
36
 
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
2010
174
Electrical-thermal co-analysis for power delivery networks in 3D system integration
Proceeding/Conference:2009 IEEE International Conference on 3D System Integration, 3DIC 2009
2009
76
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
2009
56
Interconnect performance and scaling strategy for the 22 nm node and beyond
Proceeding/Conference:Advanced Metallization Conference (AMC)
2009
114
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
Proceeding/Conference:Proceedings - Electronic Components and Technology Conference
2008
36
Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2007
27
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2008
53
 
2010
49
2007
43
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2005
40