Browsing by Author Chung, R

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Showing results 1 to 16 of 16
TitleAuthor(s)Issue DateViews
 
Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale Morphology
Proceeding/Conference:7th International Conference on Quality Control by Artificial Vision
2005
52
 
Bit-pairing codification for binary pattern projection system
Proceeding/Conference:Proceedings - International Conference on Pattern Recognition
2006
78
Boundary detection of projected fringes on surface with inhomogeneous reflectance function
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
34
 
2008
27
Handling of multi-reflections in wafer bump 3D reconstruction
Proceeding/Conference:Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
2008
67
 
Height inspection of wafer bumps without explicit 3-D reconstruction
Journal:IEEE Transactions on Electronics Packaging Manufacturing
2010
35
 
Height inspection of wafer bumps without explicit 3D reconstruction
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
34
A novel design of grating projection system for 3D reconstruction of wafer bumps
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
45
 
Optimization of bit-pairing codification with learning for 3D reconstruction
Journal:International Journal of Image and Graphics
2007
67
 
2008
86
 
Reference-free detection of semiconductor assembly defect
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2005
93
 
Reference-free machine vision inspection of semiconductor die images
Journal:International Journal of Image and Graphics
2009
94
 
Structured light-based 3D reconstruction for device with a tiny size
Proceeding/Conference:European Conference on Computer Vision's 2nd Workshop on Applications of Computer Vision
2006
41
Surface orientation recovery of specular micro-surface via binary pattern projection
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
41
 
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2005
109
 
Use of paraplanar constraint for parallel inspection of wafer bump heights
Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition
2007
33