Results 1 to 19 of 19
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TypeTitleAuthor(s)YearViews
Height inspection of wafer bumps without explicit 3-D reconstructionDong, M; Chung, R; Lam, EY; Fung, KSM201056
 
Reference-free machine vision inspection of semiconductor die imagesNg, A; Lam, EYM; Chung, R; Fung, K; Leung, W2009430
 
Handling of multi-reflections in wafer bump 3D reconstructionCheng, J; Chung, R; Lam, EY; Fung, KSM2008176
 
Erratum: Projection optics design for tilted projection of fringe patterns (Optical Engineering (2008) 47 (053002))Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F200857
 
Projection optics design for tilted projection of fringe patternsShu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2008256
 
Use of paraplanar constraint for parallel inspection of wafer bump heightsDong, M; Chung, R; Lam, EYM; Fung, SM2007141
 
Optimization of bit-pairing codification with learning for 3D reconstructionCheng, J; Chung, R; Lam, EYM; Fung, SM; Xu, Y2007225
 
Surface orientation recovery of specular micro-surface via binary pattern projectionSong, Z; Chung, R; Cheng, J; Lam, EY2006106
 
A novel design of grating projection system for 3D reconstruction of wafer bumpsShu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F2006126
 
Boundary detection of projected fringes on surface with inhomogeneous reflectance functionCheng, J; Chung, R; Lam, EYM; Fung, K; Wang, F; Leung, WH2006114
 
Boundary detection of projected fringes on surface with inhomogeneous reflectance functionCheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH200666
 
A novel design of grating projecting system for 3D reconstruction of wafer bumpsShu, Y; Chung, R; Cheng, J; Lam, EYM2006149
 
Structured light-based 3D reconstruction for device with a tiny sizeCheng, J; Chung, R; Lam, EYM200684
 
Height inspection of wafer bumps without explicit 3D reconstructionDong, M; Chung, R; Zhao, Y; Lam, EYM200696
 
Bit-pairing codification for binary pattern projection systemCheng, J; Chung, R; Lam, EY; Fung, KSM2006410
 
Height inspection of wafer bumps without explicit 3D reconstructionDong, M; Chung, R; Zhao, Y; Lam, EY2006194
 
Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale MorphologyNg, NY; Lam, EYM; Chung, R; Fung, KSM; Leung, WH2005124
 
Three-dimensional reconstruction of wafer solder bumps using binary pattern projectionCheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH2005697
 
Reference-free detection of semiconductor assembly defectNg, ANY; Lam, EY; Chung, R; Fung, KSM; Leung, WH2005701
 
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