| Title | Author(s) | Year | View Count |
 | Height inspection of wafer bumps without explicit 3-D reconstruction | Dong, M; Chung, R; Lam, EY; Fung, KSM | 2010 | 47 |
 | Reference-free machine vision inspection of semiconductor die images | Ng, A; Lam, EYM; Chung, R; Fung, K; Leung, W | 2009 | 441 |
| Handling of multi-reflections in wafer bump 3D reconstruction | Cheng, J; Chung, R; Lam, EY; Fung, KSM | 2008 | 168 |
 | Projection optics design for tilted projection of fringe patterns | Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F | 2008 | 300 |
| Erratum: Projection optics design for tilted projection of fringe patterns (Optical Engineering (2008) 47 (053002)) | Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F | 2008 | 42 |
| Optimization of bit-pairing codification with learning for 3D reconstruction | Cheng, J; Chung, R; Lam, EYM; Fung, SM; Xu, Y | 2007 | 234 |
| Use of paraplanar constraint for parallel inspection of wafer bump heights | Dong, M; Chung, R; Lam, EYM; Fung, SM | 2007 | 151 |
| Surface orientation recovery of specular micro-surface via binary pattern projection | Song, Z; Chung, R; Cheng, J; Lam, EY | 2006 | 97 |
| Height inspection of wafer bumps without explicit 3D reconstruction | Dong, M; Chung, R; Zhao, Y; Lam, EY | 2006 | 212 |
| A novel design of grating projecting system for 3D reconstruction of wafer bumps | Shu, Y; Chung, R; Cheng, J; Lam, EYM | 2006 | 149 |
| Boundary detection of projected fringes on surface with inhomogeneous reflectance function | Cheng, J; Chung, R; Lam, EYM; Fung, K; Wang, F; Leung, WH | 2006 | 129 |
| Height inspection of wafer bumps without explicit 3D reconstruction | Dong, M; Chung, R; Zhao, Y; Lam, EYM | 2006 | 87 |
| Structured light-based 3D reconstruction for device with a tiny size | Cheng, J; Chung, R; Lam, EYM | 2006 | 82 |
| Bit-pairing codification for binary pattern projection system | Cheng, J; Chung, R; Lam, EY; Fung, KSM | 2006 | 410 |
| A novel design of grating projection system for 3D reconstruction of wafer bumps | Shu, Y; Chung, R; Tan, Z; Cheng, J; Lam, EY; Fung, KSM; Wang, F | 2006 | 84 |
| Boundary detection of projected fringes on surface with inhomogeneous reflectance function | Cheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH | 2006 | 52 |
| Reference-free detection of semiconductor assembly defect | Ng, ANY; Lam, EY; Chung, R; Fung, KSM; Leung, WH | 2005 | 717 |
| Three-dimensional reconstruction of wafer solder bumps using binary pattern projection | Cheng, J; Chung, R; Lam, EY; Fung, KSM; Wang, F; Leung, WH | 2005 | 734 |
| Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale Morphology | Ng, NY; Lam, EYM; Chung, R; Fung, KSM; Leung, WH | 2005 | 119 |
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