Browsing by Author Chung, R

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Showing results 1 to 16 of 16
TitleAuthor(s)Issue DateViews
 
Automatic Segmentation For Visual Inspection In Semiconductor Manufacturing Using Multiscale Morphology
Proceeding/Conference:7th International Conference on Quality Control by Artificial Vision
2005
119
 
Bit-pairing codification for binary pattern projection system
Proceeding/Conference:Proceedings - International Conference on Pattern Recognition
2006
162
Boundary detection of projected fringes on surface with inhomogeneous reflectance function
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
124
 
2008
150
Handling of multi-reflections in wafer bump 3D reconstruction
Proceeding/Conference:Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
2008
197
 
Height inspection of wafer bumps without explicit 3-D reconstruction
Journal:IEEE Transactions on Electronics Packaging Manufacturing
2010
168
Height inspection of wafer bumps without explicit 3D reconstruction
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
139
A novel design of grating projection system for 3D reconstruction of wafer bumps
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
125
 
Optimization of bit-pairing codification with learning for 3D reconstruction
Journal:International Journal of Image and Graphics
2007
108
 
2008
185
 
Reference-free detection of semiconductor assembly defect
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2005
172
 
Reference-free machine vision inspection of semiconductor die images
Journal:International Journal of Image and Graphics
2009
163
 
Structured light-based 3D reconstruction for device with a tiny size
Proceeding/Conference:European Conference on Computer Vision's 2nd Workshop on Applications of Computer Vision
2006
99
Surface orientation recovery of specular micro-surface via binary pattern projection
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2006
178
 
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2005
190
 
Use of paraplanar constraint for parallel inspection of wafer bump heights
Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007
2007
82