Browsing by Author Rubin, BJ

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Showing results 1 to 12 of 12
TitleAuthor(s)Issue DateViews
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
Proceeding/Conference:2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
2009
58
Electrical-thermal co-analysis for power delivery networks in 3D system integration
Proceeding/Conference:2009 IEEE International Conference on 3D System Integration, 3DIC 2009
2009
99
Electromagnetic simulation for inhomogeneous interconnect and packaging structures
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2007
80
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
2009
79
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
Proceeding/Conference:Proceedings - Electronic Components and Technology Conference
2008
61
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2006
59
 
On the dual basis for solving electromagnetic surface integral equations
Journal:IEEE Transactions on Antennas and Propagation
2009
81
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2008
69
 
2010
61
2007
67
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2005
68
The use of fast integral equations solvers for practical package and interconnect analysis
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2006
70