Showing results 10 to 21 of 21
< previous
| Title | Author(s) | Issue Date | Views | |
|---|---|---|---|---|
Handling of multi-reflections in wafer bump 3D reconstruction Proceeding/Conference:Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics | 2008 | 193 | ||
Height inspection of wafer bumps without explicit 3-D reconstruction Journal:IEEE Transactions on Electronics Packaging Manufacturing | 2010 | 175 | ||
An illumination-invariant phase-shifting algorithm for three-dimensional profilometry Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2012 | 187 | ||
Intraoperative monitoring of somatosensory-evoked potential in the spinal cord rectification operation by means of wavelet analysis Proceeding/Conference:SPIE - International Society for Optical Engineering. Proceedings | 1998 | 51 | ||
A novel design of grating projection system for 3D reconstruction of wafer bumps Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2006 | 117 | ||
A polynomial phase-shift algorithm for high precision three-dimensional profilometry Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2013 | 86 | ||
Projection optics design for tilted projection of fringe patterns Journal:Optical Engineering | 2008 | 188 | ||
Reference-free detection of semiconductor assembly defect Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | 170 | ||
Regularized multiframe phase-shifting algorithm for three-dimensional profilometry Journal:Applied Optics | 2012 | 119 | ||
Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction Journal:IEEE Transactions on Electronics Packaging Manufacturing | 2008 | 209 | ||
A three-dimensional imaging system for surface profilometry of moving objects Proceeding/Conference:IEEE International Workshop on Imaging Systems and Techniques Proceedings | 2013 | 42 | ||
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | 177 |