Showing results 8 to 11 of 11
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Title | Author(s) | Issue Date | Views | |
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Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 | 130 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 | 159 | ||
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM Proceeding/Conference:IEEE Transactions on Advanced Packaging | 2007 | 119 | ||
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging | 2005 | 120 |