Browsing by Author Deutsch, A

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Showing results 5 to 11 of 11 < previous 
TitleAuthor(s)Issue DateViews
Interconnect performance and scaling strategy for the 22 nm node and beyond
Proceeding/Conference:Advanced Metallization Conference (AMC)
2009
126
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
Proceeding/Conference:Proceedings - Electronic Components and Technology Conference
2008
50
Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2007
38
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP
2008
67
 
2010
54
2007
59
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging
2005
55